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Winbond to expand Kaohsiung fab

Summary by Taipei Times
Winbond Electronics Corp (華邦電) yesterday said it plans to start expanding its Kaohsiung fab next year to boost DRAM capacity as the artificial intelligence (AI) boom drives a memorychip supercycle. Construction is scheduled to start in January, with pilot production set for the end of 2029, the comp

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Taipei TimesTaipei Times
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Winbond to expand Kaohsiung fab

Winbond Electronics Corp (華邦電) yesterday said it plans to start expanding its Kaohsiung fab next year to boost DRAM capacity as the artificial intelligence (AI) boom drives a memorychip supercycle. Construction is scheduled to start in January, with pilot production set for the end of 2029, the comp

·Taipei, Taiwan
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Taipei Times broke the news in Taipei, Taiwan on Thursday, August 6, 2026.
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