TSMC's Monthly Production Capacity Target for 2nm Next Year Is 110,000 Wafers, and for 3nm It Is 210,000 Wafers.
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It is reported that Taiwan's TSMC, the world's largest foundry (semiconductor contract manufacturing) company, will significantly expand production capacity for advanced processes such as 2 nanometers (nm, 1/1 billionth of a meter) and 3 nm next year in response to increased demand for artificial intelligence (AI) semiconductors. According to Taiwanese media such as Yonhap Report on the 14th, TSMC recently shared plans to increase production of …
By the middle of next year, TSMC’s 2nm chip production capacity will increase by 22%
The most interesting point in the comments As of now, 2nm chip sales account for about 3% of TSMC’s total cash revenue, but the company is determined to expand core production capacity. according to Taiwan mediaFrom the end of this year to the middle of next year, production will increase by 22%, from 90 silicon […]
According to ChainCatcher, supply chain sources indicate that TSMC has revealed its 2nm/3nm capacity expansion targets for next year. 2nm capacity is projected to increase from 90,000 wafers by the end of this year to 110,000 wafers by mid-next year, a 22% increase; 3nm capacity is expected to increase from over 180,000 wafers by the end of this year to 210,000 wafers by mid-next year, a more than 16% increase. TSMC declined to comment on market…
Demand for AI chips continues to increase. According to a report by US tech media Wccftech on the 12th, TSMC's advanced packaging CoWoS capacity remains tight. The market estimates that monthly capacity will increase from about 130,000 wafers at the end of 2026 to about 260,000 wafers at the end of 2028, which is equivalent to doubling in two years. In addition to expanding production, TSMC is also sharing some of the manufacturing processes wit…
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