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TSMC US Fab Getting Advanced Chip Tech Sooner than Thought

TSMC plans to invest $100 billion in Arizona to build multiple fabs and assembly plants, aiming to meet rising AI and smartphone chip demand with advanced nodes.

  • At an investor conference, C.C. Wei said TSMC will speed up production expansion and technology upgrades in Arizona while continuing to invest in Taiwan.
  • Driven by surging AI demand, TSMC’s $100 billion expansion announcement this year sparked U.S. chipmakers’ interest and plans a megafab cluster in Arizona for AI and smartphone chips.
  • TSMC confirmed it is investing US$65 billion in Arizona to build three advanced wafer fabs, with Fab 21 producing N4 chips for Apple and Nvidia since earlier this year.
  • TSMC confirmed the second Arizona fab will bring the N3 node to the U.S. in 2028, and Wei said it eyes introducing the 2nm process after Taiwan's Q4 production start this year.
  • To bridge capability gaps, TSMC is coordinating with an outsourced semiconductor assembly and test partner that has broken ground on an Arizona OSAT plant , while historically reserving its most advanced technologies for Taiwan.
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Focus Taiwan broke the news in Taiwan on Thursday, October 16, 2025.
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