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TSMC SoIC roadmap targets 2029 chip stacking
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TSMC SoIC roadmap targets 2029 chip stacking
TSMC is pushing its 3D chip-stacking roadmap towards finer interconnect pitches and tighter integration as advanced packaging becomes a larger part of performance scaling for AI and high-performance computing designs. The updated TSMC SoIC roadmap, reported after the company’s 2026 North America Technology Symposium in Santa Clara, points from 6 µm pitches today towards 4.5 µm by […] The post TSMC SoIC roadmap targets 2029 chip stacking appeared…
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