Taiwan breaks ground on advanced packaging park anchored by TSMC
The nearly 89-hectare park is expected to create more than 4,000 jobs and generate about NT$300 billion in annual production value, Lai said.
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New Kaohsiung industrial park to bolster semiconductor sector: Lai
Kaohsiung, Sept. 21 (CNA) Construction began Monday on Kaohsiung's Baipu Industrial Park, which President Lai Ching-te (賴清德) said would strengthen Taiwan's semiconductor ecosystem, balance north-south development, and boost the country's global competitiveness.
Taiwan breaks ground on advanced packaging park anchored by TSMC
By Wen-Yee Lee TAIPEI, Sept 21 (Reuters) - Taiwan broke ground on a new advanced packaging industrial park in the southern city of Kaohsiung on Monday, where TSMC plans to establish facilities for technology validation and talent training. TSMC, the w...
TSMC's 2.5D advanced packaging platform COWOS, and the related equipment and material verification base is located in Kaohsiung's Baipu Industrial Park. President Lai Qingde said at the groundbreaking ceremony on the 21st that the park is expected to create more than 4,000 jobs, with an annual output value of 300 billion yuan. In addition, Hon Hai will use about 22 square meters of land from the southern and northern bases of Pak Po to build a n…
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