ST to invest $60m in PLP line at Tours

STMicroelectronics to advance next-generation chip manufacturing technology – Telematics Wire

Press Release, 19 September 2025 What if the next smartphone, electric car, or even your smartwatch could be faster, smaller, and more energy-efficient—all thanks to how its chips are packaged? That’s exactly what STMicroelectronics (NYSE: STM) is working on with its latest breakthrough in Panel-Level Packaging (PLP) technology. The semiconductor giant just revealed details of a new $60M pilot line in Tours, France, set to go live by Q3 2026. An…

STMicroelectronics plots PLP pilot at French plant

Chipmaker STMicroelectronics upped its game in Europe with plans to establish a pilot production line for next-generation Panel-Level Packaging (PLP) technology in France by Q3 2026. It plans to test PLP production in a facility in the city of Tours as part of a broader $60 million investment to reshape its manufacturing footprint in France and Italy. The company stated it is becoming harder for wafer-level packaging and flip-chip technology to …

STMicroelectronics to launch $60M pilot line in France

Semiconductor manufacturer STMicroelectronics plans to establish a new pilot line for Panel-Level Packaging (PLP) technology at its Tours facility in France, backed by a USD 60 million investment. The pilot line is expected to be operational in the third quarter of 2026.

ST to invest $60m in PLP line at Tours

Today, ST announced it will install a Panel-Level-Packaging (PLP) production line at its site in  Tours, France. The line is expected to be operational in Q3 2026. The $60m investment ... The post ST to invest $60m in PLP line at Tours appeared first on Electronics Weekly.