South Korea’s Lee says Samsung chip packaging expansion to spur $30 billion additional investment

The Korea Times

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Samsung Electronics broke ground on a new semiconductor packaging facility at its Onyang campus in Asan, South Chungcheong Province, Thursday as part of a 144 trillion-won ($108.4 billion) investment plan by the company and three affiliates to expand advanced manufacturing capacity in the region. The company held a groundbreaking ceremony at the campus, joined by President Lee Jae Myung, Executive Chairman Lee Jae-yong, Deputy Prime Minister Lee…

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On the 12th, President Lee Jae-myung attended the groundbreaking ceremony for the Chungcheong region mega-project and toured the construction site for the advanced packaging fab. President Lee thanked Samsung Electronics Chairman Lee Jae-yong, who was also present, for "making bold investment decisions and demonstrating swift execution capabilities." On this day, President Lee visited Samsung Electronics' Onyang in Asan, South Chungcheong Provin…

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President Lee Jae-myung will attend the "Chungcheong Region Mega Project Groundbreaking Ceremony" in Asan, South Chungcheong Province, on the 12th to discuss support measures aimed at spreading investment achievements to local communities and small and medium-sized enterprises (SMEs). According to the Blue House, President Lee will attend the groundbreaking ceremony held this morning at the construction site of the Semiconductor Advanced Packagi…

연합뉴스-Yonhap News Agency

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(Seoul = Yonhap News) Reporter Ko Dong-wook = President Lee Jae-myung at the 'Chungcheong Region Mega Project Groundbreaking Ceremony' held at the Samsung Electronics Onyang Campus construction site in Asan, South Chungcheong Province on the morning of the 12th...