US EditionSK Hynix Starts Supplying Mobile DRAM with Highly Efficient Heat Dissipation
- SK Hynix Inc. launched mobile dynamic random-access memory products that focus on highly efficient heat dissipation to address rising power consumption from artificial intelligence features in devices.
- The new DRAM product uses an epoxy molding compound to protect chips from water, heat, and impact, enhancing device durability.
- Smartphones are expected to benefit from improved battery performance and lifespan due to reduced power consumption with the new product.
- Lee Gyu-jei, head of package product development at SK Hynix, stated that this launch addresses significant performance issues caused by heat during fast data transfers for AI applications.
57 Articles
57 Articles
Johnson City Press
SK hynix Starts Supplying Mobile DRAM with Highly Efficient Heat Dissipation
Company first in industry to develop High-K EMC material, improves thermal conductivity by 3.5 times, thermal resistance by 47%Customers expect achievement to help address heat issue generated from on-device AISK hynix to lead next-generation DRAM for mobile device through technological…
SK Hynix's New DRAM Could Make Phones Faster & Cooler
DRAM is one of the crucial components of a smartphone. Especially with the increasing AI integration, its importance has only increased. However, a higher workload comes with higher heating. And to tackle this, manufacturers are working hard to develop energy-efficient chips. One of the leading companies in this race, SK hynix, has now announced a better heat dissipation tech in mobile DRAM. SK hynix begins supply for mobile DRAM with better hea…
SK hynix DRAM chills phones, speed soars
SEOUL, South Korea, Aug. 28, 2025 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhyni) announced today that it has started supplying mobile DRAM products with highly efficient heat dissipation by adopting the High-K Epoxy Molding Compound* material for the first time in the industry. * EMC(Epoxy Molding Compound): a critical material for semiconductor packaging that protects chips from various external conditions such as wate…
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