SK Hynix Unveils First HBF Standard Specifications with Sandisk, Presenting AI Memory Solutions at 'FMS 2026'
The new High Bandwidth Flash standard links HBM-like speed with NAND-like capacity, and the first specs were disclosed through the Open Compute Project.
- On Tuesday, August 4, 2026, SK Hynix and SanDisk unveiled the first technical specifications for High Bandwidth Flash at the Future of Memory and Storage 2026 conference in Santa Clara, California.
- Developed through the Open Compute Project , the standard arrives six months after the consortium launched in February to address AI memory bottlenecks with a unified, high-capacity, high-bandwidth framework.
- The HBF specification adopts the Universal Chiplet Interconnect Express interface, supporting capacities up to 512GB and scalable performance from approximately 0.4TB/s to 3.0TB/s across three grades.
- Google and Tenstorrent contributed to the standardization process, while SK Hynix and SanDisk leaders will present a panel discussion titled 'Breaking the Memory Wall with High Bandwidth Flash' on Thursday, August 6.
- Beyond the HBF standard, the company unveiled its tenth-generation 375-layer 4D NAND wafer, offering a 2.5 times increase in power efficiency, with mass production of high-capacity eSSDs planned for early next year.
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(Santa Clara = Yonhap News) Correspondent Kwon Young-jeon = SK Hynix, which announced the High Bandwidth NAND Flash (HBF) standard, and SanDisk of the United States [are addressing] the limitations of artificial intelligence (AI) memory...
SCIENCE & TECH: SK Hynix and SanDisk reveal first specs for High Bandwidth Flash — but don’t get too excited, you probably won’t be able to buy it anytime soon
The first HBF specification defines stacks of up to 512GB with three bandwidth grades from roughly 0.4TB/s to 3.0TB/s, connected to processors over UCIe and published openly through the Open Compute Project Google and Tenstorrent have joined the consortium, but Nvidia is not among the named participants, which matters more to HBF’s prospects as a de facto alternative to increasingly pricey HBM Samples of the first AI inference devices built with…
SK Hynix and SanDisk reveal first specs for High Bandwidth Flash — but don't get too excited, you probably won't be able to buy it anytime soon
The first HBF specification defines stacks of up to 512GB with three bandwidth grades from roughly 0.4TB/s to 3.0TB/s, connected to processors over UCIe and published openly through the Open Compute ProjectGoogle and Tenstorrent have joined the consortium, but Nvidia is not among the named participants, which matters more to HBF's prospects as a de facto alternative to increasingly pricey HBMSamples of the first AI inference devices built with H…
High Bandwidth Flash gets first technical specification for AI data centers
A year ago, SanDisk and SK Hynix announced a collaboration to develop a common standard for the High Bandwidth Flash (HBF) project. The new type of memory is designed to improve performance and power efficiency in AI data centers and can now be implemented in new data center projects thanks...Read Entire Article
SK Hynix and Sandisk May Have Just Solved AI's Biggest Bottleneck -- And It Could Reshape the Memory Market
Artificial intelligence has turned computing into a memory problem as much as a processing problem. Chipmakers have spent years building faster GPUs, but those processors can only work as quickly as data reaches them. That has made high-bandwidth memory (HBM) one of the hottest commodities in technology. Demand has outpaced supply so badly that HBM ... SK Hynix and Sandisk May Have Just Solved AI’s Biggest Bottleneck — And It Could Reshape the M…
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