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Scientists are racing to create materials tough enough for hypersonic flight
Battalion Advanced Technology will fund up to $6 million as Penn State researchers develop semiconductors and heat-resistant alloys for extreme environments.
On July 16, Penn State and Battalion Advanced Technology launched a three-year research collaboration backed by up to $6 million to develop advanced semiconductors and high-temperature materials for defense and strategic industries.
Researchers at the Materials Research Institute will lead the two projects, aiming to solve critical engineering challenges in environments where conventional materials cannot operate, including hypersonics and nuclear applications.
Leading the semiconductor team, Joan Redwing, distinguished professor of materials science and engineering, aims to "minimize crystalline defects and interfacial thermal resistance," while Douglas Wolfe oversees the alloy project seeking to "accelerate the development of refractory alloys."
Senator Dave McCormick noted the partnership strengthens Pennsylvania's role as a hub for American innovation and strategic national security technology, positioning the state as central to advanced materials development.
If successful, the work could enable electronics and components to operate in extreme environments where conventional materials fail, with applications spanning defense, hypersonics, nuclear technology, and space exploration.