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Schneider Electric unveils new prefabricated reference design engineered for modular AI factories
The blueprint combines power management, liquid cooling and software interoperability, and a companion study found prefabricated pods cut onsite installation time by 80%, Schneider Electric said.
On Wednesday, October 21, 2026, Schneider Electric announced its RapidScale Modular Data Center Reference Design 115, providing a pre-engineered blueprint for high-density AI infrastructure to streamline onsite logistics and accelerate global deployment.
Rising demand for AI capacity, expected to account for approximately 65% of total workloads by decade's end, is forcing developers to abandon traditional stick-built construction methods facing power and cooling challenges.
A new study co-authored with Compass Datacenters, titled "Prefabricated White Space Module Time Study: Lessons from a High-Density Liquid-Cooled Deployment" , found prefabricated pods cut onsite installation time from 75.5 hours to 15 hours per pod, an 80% reduction.
The reference design supports the NVIDIA Vera Rubin Platform, including configurations for NVIDIA GB300 NVL72 racks of up to 142 kW per rack, integrating power management and liquid cooling to maximize compute performance.
Leveraging a manufacturing footprint of 1.35 million square feet across 10 countries, RapidScale incorporates approximately 90% in-house manufactured equipment, ensuring supply chain certainty and full lifecycle support for operators.