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Numerical Simulation of Temperature Distribution and Atomic Diffusion in Resistance-Assisted Transient Liquid Phase Bonding of Thin Sections
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Numerical Simulation of Temperature Distribution and Atomic Diffusion in Resistance-Assisted Transient Liquid Phase Bonding of Thin Sections
Transient Liquid Phase (TLP) bonding is a promising technique for joining thin sections in microelectronics and precision engineering. However, achieving uniform heat distribution and controlled diffusion in thin-walled components remains challenging. This study presents a comprehensive numeri...
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