Samsung Chairman Highlights Chip Packaging, Visits Japanese Unit
8 Articles
8 Articles
Samsung Electronics announced that Chairman Lee Jae-yong visited the advanced semiconductor packaging research base in Yokohama, Japan, on the 1st. This research base serves as a link between Samsung Semiconductor and Japanese semiconductor materials, components, and equipment companies. In a press release on the same day, Samsung Electronics stated that Chairman Lee [visited] the semiconductor packaging research
On the company's founding anniversary, Samsung Electronics Chairman Lee Jae-yong visited APL, a semiconductor packaging research base in Yokohama, Japan, to inspect the status of technology development and discuss cooperation in the materials, components, and equipment sectors, demonstrating a technology-oriented management approach.
Samsung chairman highlights chip packaging, visits Japanese unit
Samsung Electronics Executive Chairman Lee Jae-yong visited the company’s semiconductor advanced packaging technology laboratory in Japan, Sunday, pledging to continue expanding its research workforce there and develop the lab into a global R&D hub for next-generation packaging technologies. According to Samsung Electronics, Lee visited Advanced Package Lab (APL) in Yokohama and discussed with researchers the latest developments in technologies …
(Seoul = Yonhap News) Reporter Park Cho-rong = Samsung Electronics Chairman Lee Jae-yong visited an advanced semiconductor packaging research base in Yokohama, Japan on the 1st to inspect the status of technology development.
Samsung Electronics Chairman Lee Jae-yong visited an advanced semiconductor packaging research base in Yokohama, Japan, to inspect the status of next-generation technology development. Through successive visits to Japan, Chairman Lee is strengthening cooperation with the local semiconductor ecosystem and securing advanced packaging technology, which has emerged as a key element of competitiveness in artificial intelligence (AI) semiconductors. O…
First on-site inspection just two months after opening… Overseeing next-generation processes such as wafer bonding and glass substrates Approximately 350 billion won to be invested over 5 years… Fostering an R&D hub connecting Japan's materials, parts, and equipment ecosystem "Packaging is the fundamental competitiveness of semiconductors in the AI era"… Accelerating global supply chain technology alliances [Digital Daily Reporter Bae Tae-yon…
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