KLA Unveils Comprehensive IC Substrate Portfolio for a New Era of Advanced Semiconductor Packaging
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4 Articles
The Chandler Arizonan
ShareTrendingKLA Unveils Comprehensive IC Substrate Portfolio for a New Era of Advanced Semiconductor Packaging
New portfolio drives chip performance with panel-based interconnect innovationKLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging platform to support mainstream and advanced IC substrate lithography requirementsNew Lumina™ inspection and metrology…
New Product Portfolio Boosts Chip Performance Through Substrate Interconnect Innovations KLA extends technology from the market-proven Corus™ direct imaging system with the Serena™ direct imaging platform to support mainstream and advanced IC substrate lithography needs New Lumina™ inspection and metrology systems further enable efficient high-quality production and yield for IC substrate (including glass substrates) and panel interposer manufac…
KLA Unveils comprehensive IC substrate portfolio for a New Era of advanced semiconductor packaging
New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging platform to support mainstream and advanced IC substrate lithography requirements New Lumina™ inspection and metrology systems further equip IC substrate (including glass core) and panel-based interposer makers to efficiently build advanced products …
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