Intel's Rio Rancho Fab Becomes Test Case for AI-Era Chip Packaging

Intel's Rio Rancho fab becomes test case for AI-era chip packaging

Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions Rio Rancho — its New Mexico site — as a global hub for next-generation packaging production.

Intel Foundry's Rio Rancho Facility To Become Its Crown Jewel In Production of Next-Gen Glass Substrates

Intel Foundry is leading the race towards Glass Substrates with its Rio Rancho facility, aiming to become the world's first to initiate mass production. Glass Substrates Are The Future of Semiconductors & Intel Foundry is Well on Its Way To Become The First To Initiate Mass Production Glass Core substrates have been gaining interest, as they have several benefits over traditional organic substrate solutions. The current substrates are also facin…