US EditionThis New 3D Chip Could Break AI’s Biggest Bottleneck
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2 Articles
This new 3D chip could break AI’s biggest bottleneck
Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically speeding up how data moves inside the chip. Unlike traditional flat designs, this approach avoids the traffic jams that limit today’s AI hardware. The prototype already beats comparable chips by several times, with future versions expected to go much further. Just as important, it was manufactured entirely in a U.S. foundry,…
Researchers have developed the first monolithic 3D chip produced entirely in a foundry of American semiconductors and offering superior performance than conventional 2D chips. Consisting of layers of extremely fine circuits stacked together and connected by dense vertical wiring, the chip would have overcome the fundamental limit of the "memory wall" – an essential requirement to meet the growing needs of the AI for computing power. [...] This a…
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