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dorsaVi (ASX:DVL) starts tape-out and the RRAM story finally leaves the drawing board
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dorsaVi (ASX:DVL) starts tape-out and the RRAM story finally leaves the drawing board
Silicon now goes into fabrication with TSMC wafers, and the next 12 months become an execution test dorsaVi (ASX:DVL) has commenced tape-out of its first RRAM-CMOS validation chip, the step that pushes the program out of the design suite and into a semiconductor fab. For a micro-cap that has spent almost two years asking investors to believe in a roadmap, this is the moment the roadmap starts becoming silicon. The chip uses commercial CMOS front…
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