AMD's Next-Gen Zen 7 "Grimlock" CPUs To Utilize TSMC 1.4nm Process Tech & FOPLP Packaging, Launching in 2028
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7 Articles
AMD would already be preparing its next big jumps beyond Zen 6, and that brings us directly to Zen 7. According to information published by the Commercial Times, the AMD Zen 7 architecture, whose CCD would have the codename “Grimlock”, would be designed to use the TSMC A14 node. That is, a future 1.4 nm class manufacturing process of the Taiwanese company. The time window mentioned is 2028. The key to the news is that AMD would not only be looki…
Last week, a look at two internal presentation slides revealed Intel's plans for the coming core generations.
The visit to Taiwan by AMD CEO Dr. Lisa Su fuels the rumor kitchen about AMD Zen 7: The "Grimlock" CCDs are to be manufactured in 1.4 nm and with novel packaging at TSMC, combined with the next 3D V-Cache. It's starting from 2028.
AMD has allegedly started to prepare the production of its future Zen-7 processors. According to reports, the manufacturer skips several production stages and relies directly on 1.4-nanometer technology as well as a new packaging technology. (Continue reading)
AMD "Zen 7" IP to Use TSMC A14 Node and More Advanced Packaging
AMD is gradually preparing to launch its next-generation "Zen 6" series of processors under the new EPYC "Venice" server CPU family. Meanwhile, development of the "Zen 7" architecture has been ongoing for quite some time, and it seems we are finally learning which manufacturing node AMD will use for this CPU generation. According to Taiwanese media outlet Commercial Times, AMD is reportedly considering TSMC's A14 node, officially utilizing the f…
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