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3M Participates in JOINT3, a Next-Generation Semiconductor Packaging Consortium

  • 3M has joined the JOINT3 consortium, which includes global leaders in semiconductor materials, equipment, and design.
  • The consortium aims to enhance manufacturing efficiency and performance of 515 x 510mm panel-level organic interposers.
  • Resonac Corporation established JOINT3 to accelerate the development of tools for connecting different parts of electronic devices.
  • 3M plans to leverage its materials science expertise to advance semiconductor manufacturing.
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3M participates in JOINT3, a next-generation semiconductor packaging consortium

ST. PAUL, Minn., Sept. 30, 2025 /PRNewswire/ -- 3M has joined the next-generation semiconductor packaging consortium JOINT3, an effort to bring together global leaders in semiconductor materials, equipment and design.

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Major Tech Alliance: 3M Joins Global Consortium to Revolutionize AI Chip Manufacturing Technology

3M partners in JOINT3 consortium to develop panel-level organic interposers for AI and autonomous vehicle chips. Platform uses 515x510mm prototype line for advanced semiconductor packaging.

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PR Newswire broke the news in United States on Wednesday, October 1, 2025.
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