Xiaomi takes another shot at Qualcomm and MediaTek with its 3nm flagship Xring O3 chip
The chip adds a 10-core CPU, 200 TOPS AI hardware and LPDDR6 support as Xiaomi seeks more control over its smartphone roadmap.
- On Monday, August 24, 2026, Xiaomi unveiled the XRING O3, a flagship 3nm system-on-chip featuring a 10-core CPU and native LPDDR6 memory support for its premium devices.
- Manufactured by TSMC, the platform signals Xiaomi's push for semiconductor self-reliance, aiming to reduce dependence on Qualcomm and MediaTek while enabling tighter hardware-software integration.
- Performance data shows the chip achieves a 5.22 million AnTuTu score and 200 TOPS of tensor performance, delivering a 45% increase in edge AI capabilities for Xiaomi's MiMo large language models.
- Xiaomi confirmed the processor will debut in the Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max this September, though analysts expect limited initial production volumes.
- Bloomberg Intelligence analysts noted Xiaomi's 3nm strategy emphasizes architectural upgrades while rivals transition to 2nm, though the company remains dependent on established partners for most smartphone lineups.
11 Articles
11 Articles
Xiaomi takes another shot at Qualcomm and MediaTek with its 3nm flagship Xring O3 chip
Built on a 3-nanometer process, the chip is designed for flagship devices, with a focus on AI workloads, graphics performance, and camera processing. The manufacturing technology puts Xiaomi closer to Apple's latest A19 Pro chips and ahead of Huawei's current in-house smartphone processors.Read Entire Article
Xiaomi targets Apple and Qualcomm with custom XRING O3 chip: Check full specs
Xiaomi has officially taken the wraps off its flagship XRING O3 processor–a custom 3nm system-on-chip that shatters benchmark records with a 5.22-million AnTuTu score, introduces the mobile industry's first native LPDDR6 memory support, and delivers 200 TOPS of localized AI computing power.
(Beijing=Yonhap News) Correspondent Jung Sung-jo = China's largest DRAM... in the latest processor 'XRING (Chinese name Xuanjie) O3' announced by China's Xiaomi
Read the original note in the following link: Xiaomi presents the new home made Xring O3, O100 and D100 Xiaomi chips announced three own processors for phones, artificial intelligence and vehicles: the Xring O3, the Xring O100 and the Xring D100. Xring O3 for mobiles The Xring O3 is manufactured with the TSMC 3-nanometer process and uses a 10-core CPU. Its configuration would include two C1-Ultra cores at 4.35 GHz, four C1-Premium at 3.68 GHz an…
Xiaomi's XRING O3 Chip Debuts With Record AnTuTu Score, First-Ever CXMT LPDDR6 Memory in China Chip Milestone
Xiaomi's XRING O3 processor, featuring LPDDR6 memory, sets new performance benchmarks and marks a significant milestone for China's domestic chip industry, with CXMT as the key memory supplier.
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