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South Korea’s Lee says Samsung chip packaging expansion to spur $30 billion additional investment

Summary by WTVB
SEOUL, Nov 12 (Reuters) - South Korean ​President ‌Lee Jae Myung said ‌on ​Thursday ⁠that Samsung ⁠Electronics' 6 trillion won ($4.48 billion) investment ​in a ⁠high-bandwidth ⁠memory ​chip packaging ​plant in Asan, ‌South Korea, would be ⁠followed by ...

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On the 12th, President Lee Jae-myung attended the groundbreaking ceremony for the Chungcheong region mega-project and toured the construction site for the advanced packaging fab. President Lee thanked Samsung Electronics Chairman Lee Jae-yong, who was also present, for "making bold investment decisions and demonstrating swift execution capabilities." On this day, President Lee visited Samsung Electronics' Onyang in Asan, South Chungcheong Provin…

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President Lee Jae-myung will attend the "Chungcheong Region Mega Project Groundbreaking Ceremony" in Asan, South Chungcheong Province, on the 12th to discuss support measures aimed at spreading investment achievements to local communities and small and medium-sized enterprises (SMEs). According to the Blue House, President Lee will attend the groundbreaking ceremony held this morning at the construction site of the Semiconductor Advanced Packagi…

(Seoul = Yonhap News) Reporter Ko Dong-wook = President Lee Jae-myung at the 'Chungcheong Region Mega Project Groundbreaking Ceremony' held at the Samsung Electronics Onyang Campus construction site in Asan, South Chungcheong Province on the morning of the 12th...

·Seoul, Korea (the Republic of)
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President Lee Jae-myung visited the groundbreaking ceremony for the mega-projects on the 12th and stated, “Three high-tech investment projects in Chungcheong that will reshape the industrial map of Korea have vigorously broken ground,” adding, “We will concentrate all policy capabilities to ensure that this is completed as genuine balanced national development and growth for all that substantially changes the lives of the region and the people.”…

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WTVB broke the news on Wednesday, November 11, 2026.
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