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Published 1 month ago

SK hynix to invest $4 billion in Indiana for advanced chip packaging facility

Summary by Ground News
SK hynix is set to invest approximately $4 billion in building an advanced chip packaging facility in Indiana. The project, which was announced in 2022, had its location unconfirmed until now. The packaging plant, located adjacent to Purdue University, could commence operations in 2028. It is expected to provide jobs for up to 1,000 people.

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