Samsung ships 12-layer HBM4 to Nvidia in February; 8-layer variants planned for 2027
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Samsung & SK hynix Reportedly Set To Ramp 8-Layer HBM4 Shipments For NVIDIA’s Rubin Ultra In Q2 2027, As Heat And Yield Issues Continue To Complicate 12-Layer Stack Manufacturing
NVIDIA reportedly entered into discussions with Samsung and SK hynix in the third quarter of 2026 to supply HBM4 memory with 8-layer stacks instead of 12-layer ones, despite a previous update mentioning that Rubin GPUs will stick with the more advanced memory. Fortunately, NVIDIA’s suppliers aren’t expected to completely phase out 12-layer HBM4 and HBM4E DRAM, but Samsung and SK hynix will boost the volume of 8-layer stacks in the second quarter…
NVIDIA is evaluating 8- and 12-layer HBM4 hybrid architectures for the Rubin Ultra. Samsung and SK hynix are targeting 8-layer HBM4 shipments in the second quarter of 2027.
Samsung and SK hynix aim to supply 8-layer HBM4 batteries to Nvidia in 2027, according to a report that also places in February Samsung’s initial shipments of 12-layer versions. Samsung confirmed that it already sends commercial HBM4 and reported 11.7 Gbps speeds; manufacturing performance and heat management could influence competition for orders.
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