US EditionSamsung aims for 2026 HBM4 mass production after customer validation
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3 Articles
digitimes.com
technewstube.comSamsung aims for 2026 HBM4 mass production after customer validation
Samsung Electronics plans to begin mass production of its sixth-generation high-bandwidth memory chips in 2026, citing positive feedback from customers as the South Korean tech giant seeks to reclaim its lead in the competitive artificial intelligence hardware market.
The JEDEC industry committee is developing the advanced SPHBM4 (Standard Package High Bandwidth Memory 4) standard, designed to make high-performance memory production more affordable. HBM (High Bandwidth Memory) technology is a type of ultra-fast memory module primarily used in AI accelerators and server GPUs. The current HBM3 standard utilizes 1024 pins, which is considered technologically advanced... The post SPHBM4: Affordable Memory for AI …
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