US EditionSamsung Electronics says customers praised competitiveness of HBM4 chip
Samsung highlights HBM4's market edge and plans AI integration in all products to meet rising global AI chip demand, leveraging its comprehensive chipmaking capabilities.
- On Jan 2, Jun Young‑hyun and Roh Tae‑moon issued New Year messages highlighting HBM4 competitiveness and a push to strengthen AI capacity, with Jun saying `On HBM4 in particular, customers have even stated that 'Samsung is back'`.
- Jun warned competition was intensifying rapidly and AI demand is now a given, saying unprecedented AI-chip demand requires bolder investment as 2026 will be tougher than last year, while Roh stressed integrating AI across products so the DX division can improve customer experiences.
- Quoting Jun, the company framed a one‑stop chip offering as a competitive advantage, saying `Samsung Electronics is the only chipmaker in the world that offers a one-stop solution encompassing logic chips, memory, foundry services and advanced packaging`, and noted the foundry business is 'primed for a great leap forward' after its $16.5 billion Tesla deal.
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Samsung Electronics says customers praised competitiveness of HBM4 chip
Samsung Electronics customers have praised the differentiated competitiveness of its next-generation high-bandwidth memory (HBM) chips, or HBM4, saying "Samsung is back", co-CEO and chip chief Jun Young-hyun said in a New Year address.
Samsung co-CEOs vow to strengthen company's AI capacity in New Year's message
The co-chief executive officers of Samsung Electronics Co. on Friday vowed to lead the company in strengthening its artificial intelligence (AI) capacity amid intensifying global competition in the field. Samsung Electronics Vice Chairman and CEO Jun Young-hyun, who heads the company's key device solutions (DS) division that oversees its chip operations, highlighted the importance of responding to unprecedented demand for AI chips in the global …
The South Korean electronics giant was negotiating memory chips with Nvidia in October and is racing to catch up with rivals, including fellow South Korean company SK Hynix, in AI chips.
Refor will be used to "response search without previous IA semiconductors", referred to the executable.
Thanks to HBM4, chipmaker declares 'Samsung is back' in New Year messages from vice chair, president
Samsung Electronics claimed that the Korean chipmaker earned back its technological competitiveness in memory with high client evaluation marks for sixth-generation high bandwidth memory (HBM4) chips in its New Year’s message on Friday.
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regionalmedianews.comSamsung Electronics highlights progress in HBM4 chip supply
SEOUL, Jan 2 : Samsung Electronics highlighted on Friday progress in the company’s next-generation high-bandwidth memory (HBM) chips, or HBM4, saying customers have praised its competitiveness. Samsung Electronics’ co-CEO Jun Young-hyun, who leads the chip division, said in a New Year address that HBM4 had drawn strong customer praise for its differentiated competitiveness, with some customers saying “Samsung is back.” In October, Samsung …
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