Get access to our best features
Get access to our best features
Published 22 days ago

MediaTek’s Dimensity 9400 Rumored To Sport The Biggest Die Size For A Smartphone Chipset, With More Than 30 Billion Transistors

Summary by Wccftech
MediaTek plans to go all out with the upcoming Dimensity 9400 in sheer size, as a fresh rumor floating around claims that the SoC will flaunt the biggest die size to be used in a smartphone platform ever. Thanks to this size increase, the Dimensity 9400 is also said to sport in excess of 30 billion transistors, making the count 32 percent higher than the 22.7 billion transistors found on the Dimensity 9300. Dimensity 9400’s GPU details also ment…

0 Articles

All
Left
Center
Right
Think freely.Subscribe and get full access to Ground NewsSubscriptions start at $9.99/yearSubscribe
Ground News Article Assistant
Not enough coverage to generate an Article Assistant.

Bias Distribution

  • There is no tracked Bias information for the sources covering this story.
Factuality

To view factuality data please Upgrade to Premium

Ownership

To view ownership data please Upgrade to Vantage

Sources are mostly out of (0)