Laser Annealing Integrates Optical Isolators Directly Onto Silicon Photonics Chips without Overheating

Laser-made optical isolator cuts reflected light 95% on silicon chips

Kyocera and Tohoku University developed a laser-made optical isolator that cuts back-reflected light by about 95%.

Laser annealing integrates optical isolators directly onto silicon photonics chips without overheating

Kyocera Corporation and the Research Institute of Electrical Communication (RIEC) at Tohoku University have developed a new technology that integrates optical isolators directly onto silicon photonics chips using laser annealing, a method that applies localized heat treatment using a laser.

Kyocera and Tohoku University Develop Technology to Integrate Optical Isolators Directly onto Silicon Photonics Chips

Kyocera Corporation and the Research Institute of Electrical Communication (RIEC), Tohoku University have developed a new technology for integrating optical isolators onto silicon photonics chips using "laser annealing," a localized, laser-based heat-treatment method.

Laser annealing enables optical isolators integrated directly on silicon photonics chips

A laser annealing method integrates optical isolators directly onto silicon photonics chips, reducing back-reflected light by about 95% without damaging surrounding components.