Intel Exceeds a Million Wafers with EUV High-NA and Accelerates Its Industrial Offensive
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[Digital Daily Reporter Kim Moon-ki] Intel Foundry and ASML announced on the 8th that they processed over 1 million wafers using High NA EUV lithography equipment at the 'SPIE Photomask Technology and Extreme Ultraviolet (EUV) Lithography Conference' held in Monterey, California. Naga Chandrasekaran, Executive Vice President at Intel and Co-General Manager of Intel Foundry, stated, "Companies building complex AI products of the future require m…
Intel is the first chip maker to use ASML's latest lithography systems. At the same time, the development of larger masks is underway.
Intel reported that it has already processed over a million 300-millimeter wafers with EUV High-NA scanners, a milestone that the company presents as superior to the combined volume of the rest of the industry. Intel also evaluates 6×12-inch photo masks to prevent field bonding, boost performance, and open a new dispute over the advanced lithography standard.
Intel surpasses one million High-NA EUV wafers processed, outpaces the rest of the industry combined — company also trailblazing giant 6×12 photomasks to speed production and lower costs
Intel announced on Monday that it had processed more than one million 300-mm wafers using its High-NA EUV scanners, less than two and a half years after its first tool was assembled. For now, the company intends to use industry-standard 6-inch photomasks, which can expose 26×16.5 mm half-fields and therefore require field stitching for larger chips. However, Intel is also working on larger 6×12-inch photomasks that would enable High-NA EUV scann…
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