Unimicron Says Intel's EMIB-T Will Not Reach Mass Production Until 2027, Sharpening Advanced Packaging Rivalry

Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry

TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach true mass production until 2027. The substrate maker said the new platform is already drawing three suppliers, all targeting an initial 50% yield.

TSMC moves in on Intel's Turf with EMIB-like packaging tech, challenging a key foundry edge

TSMC is developing an Intel EMIB-like packaging technology, potentially eroding one of Intel's key foundry advantages amid booming AI chip demand.

TSMC Reportedly Develops Quasi-EMIB Chip Packaging as CoWoS Capacity Tightens

TSMC is reportedly working with substrate manufacturer Kinsus Interconnect Technology on an advanced packaging system described internally as “quasi-EMIB. ” According to The Information, the approach is intended to offer some of the flexibility associated with Intel’s Embedded Multi-Die Interconnect Bridge.

TSMC Develops EMIB-like Technology to Compete with Intel

TSMC is reportedly developing an advanced packaging technology to rival Intel's Embedded Multi-die Interconnect Bridge (EMIB), which the company internally refers to as EMIB-like. According to sources close to The Information, TSMC's Chip-on-Wafer-on-Substrate (CoWoS) packaging might lose some customers to Intel's EMIB. As a result, TSMC has begun developing its EMIB-like technology. This development will reportedly be supported by Taiwan's Kins…