TSMC Moves in on Intel's Turf with EMIB-Like Packaging Tech, Challenging a Key Foundry Edge

TSMC moves in on Intel's Turf with EMIB-like packaging tech, challenging a key foundry edge

TSMC is developing an Intel EMIB-like packaging technology, potentially eroding one of Intel's key foundry advantages amid booming AI chip demand.

TSMC Develops EMIB-like Technology to Compete with Intel

TSMC is reportedly developing an advanced packaging technology to rival Intel's Embedded Multi-die Interconnect Bridge (EMIB), which the company internally refers to as EMIB-like. According to sources close to The Information, TSMC's Chip-on-Wafer-on-Substrate (CoWoS) packaging might lose some customers to Intel's EMIB. As a result, TSMC has begun developing its EMIB-like technology. This development will reportedly be supported by Taiwan's Kins…

Intel strengthens position in packaging tech as TSMC scrambles to respond

Intel's advancements in packaging tech could reshape the semiconductor landscape, challenging TSMC's dominance and diversifying industry options. The post Intel strengthens position in packaging tech as TSMC scrambles to respond appeared first on Crypto Briefing.

TSMC Concedes Intel's EMIB Packaging Is A Potent Contender, Starts Building "Quasi-EMIB" As CoWoS Remains Choked Through 2026

With TSMC's CoWoS advanced capacity egregiously constrained, and Intel's more nimble EMIB attracting a growing volume of orders, the Taiwan-based chipmaker has realized that it needs to change course to retain its competitive edge. And, it has chosen to do so by attempting to clone some elements of Intel's novel approach to advanced packaging, as per the reporting by The Information. Apparently, the new packaging project is referred to internall…

Google could build more AI accelerators than Nvidia sells in 2028, analyst claims — could push the company to use Intel Foundry to meet its goals

Google was among the first hyperscalers to develop its own custom AI processors about a decade ago and has been steadily ramping their deployment since then. The company seems to be so confident about its TPU v9 due in 2028 that it intends to order 12 – 15 million of such processors, according to a Fubon Research note to clients published by Sean. If the information is correct, Google may not only produce more or a comparable number of AI accele…