IBM and Siemens Collaborate on Research to Advance Nanostack Architecture
IBM and Siemens will develop virtual models and fabrication tools to speed nanostack toward production, building on a design that packs nearly 100 billion transistors.
- On Wednesday, IBM and Siemens announced a research collaboration to advance Nanostack, IBM's three-dimensional transistor architecture, aiming to accelerate manufacturing and design capabilities for future production.
- IBM unveiled the Nanostack architecture earlier this year, a 3D design that vertically stacks and staggers transistors to shift semiconductor scaling from 2D to 3D—a new industry paradigm.
- Nanostack currently packs nearly 100 billion transistors at a 7 angstrom node, using different material combinations within stacked layers to independently optimize performance and power efficiency of each transistor.
- Siemens will contribute electronic design automation and simulation expertise to develop advanced virtual models, allowing IBM and Siemens to optimize designs and address fabrication challenges before physical production.
- Scaling semiconductors into the angstrom era demands co-optimization between device physics and manufacturing software, positioning Nanostack to support AI and emerging technologies over the coming decade beyond the current 7 angstrom node.
12 Articles
12 Articles
PR Newswire
IBM and Siemens Collaborate on Research to Advance Nanostack Architecture
/PRNewswire/ -- Today, IBM (NYSE: IBM), in collaboration with Siemens, announced new research aimed at advancing IBM's nanostack architecture, a new transistor...
IBM and Siemens are teaming up to develop a new chip manufacturing technology that could pack nearly 100 billion transistors onto an area the size of a fingernail. The goal is to create more powerful and energy-efficient semiconductors to meet the growing demands of artificial intelligence and advanced computing. The two companies […]
IBM and Siemens Collaborate on Research to Advance Nanostack Architecture - CanadianSME Small Business Magazine
Collaboration aims to accelerate development of the manufacturing and design capabilities needed for future nanostack generations IBM (NYSE: IBM), in collaboration with Siemens, announced new research aimed at advancing IBM’s nanostack architecture, a new transistor architecture unveiled by IBM earlier this year. The collaboration will bring together IBM’s leadership in semiconductor device innovation and Siemens’ expertise in electronic design …
IBM and Siemens collaborate on Nanostack architecture research
IBM, in collaboration with Siemens, has announced new research aimed at advancing IBM’s nanostack architecture, a new transistor architecture unveiled by IBM earlier this year. The collaboration will bring together IBM’s leadership in semiconductor device innovation and Siemens’ expertise in electronic design automation (EDA), process simulation, lithography optimization, and advanced manufacturing software to accelerate the […]
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