Samsung reveals three-phase HBM roadmap that puts logic and compute inside memory — zHBM ultimately stacks DRAM directly on top of the processor

Samsung New Memory Roadmap: HBM5 Aims for 2x Performance, zHBM for 8x

Samsung presented its updated memory roadmap at SEMICON Taiwan 2026, with HBM5 and the upcoming zHBM architecture being the main focus points while setting ambitious goals and expectations. According to Samsung, HBM5 is targeting twice the performance and 20% higher performance per watt compared to HBM4E, alongside a 20% reduction in thermal resistance. As changes, the base die moves from the 4 nm process used in HBM4 and HBM4E to Samsung's in-h…

Samsung zHBM Roadmap Ultimately Stacks DRAM Directly Above the Processor

Samsung has outlined an ambitious three-stage roadmap for High Bandwidth Memory, culminating in an architecture called zHBM that effectively merges memory and compute into the same vertically integrated package.

Samsung reveals three-phase HBM roadmap that puts logic and compute inside memory — zHBM ultimately stacks DRAM directly on top of the processor

Samsung detailed a three-phase HBM roadmap at Hot Chips 2026 that progressively moves logic into the base die and ultimately stacks DRAM directly on the processor.