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Emerging Trends and Key Markets in 2.5D and 3D Semiconductor Packaging

Summary by IDTechEx
IDTechEx Research Article: Emerging advanced semiconductor packaging technologies, such as 2.5D and 3D hybrid bonding, are crucial for enhancing system performance across various applications such as AI and high-performance computing. This article explores the technology development trends in 2.5D and 3D packaging technologies and the key market growth drivers.
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