Ceva and Mobilint Advance Physical AI with REGULUS Edge AI SoC
- Ceva announced that Mobilint deployed Ceva’s SensPro AI DSP and NeuPro-Nano NPU in its REGULUS edge AI SoC, the first production deployment of the NeuPro NPU family.
- REGULUS combines the SensPro AI DSP and NeuPro-Nano NPN32 NPU in an integrated processing architecture for on-device AI.
- The SoC delivers 10 TOPS of AI performance at under 3W and supports up to 8GB of memory for applications including robotics, drones, cameras, and IoT devices.
- REGULUS powers Mobilint’s MLD-R1 AI USB accelerator, which is now shipping.
45 Articles
45 Articles
Ceva AI processors enter production in Mobilint Edge AI chip
Ceva’s NeuPro-Nano neural processing unit (NPU) has entered its first production deployment, forming part of Mobilint’s REGULUS Edge AI system-on-chip (SoC), designed for real-time processing in power-constrained devices. The REGULUS SoC combines Ceva’s NeuPro-Nano NPU and SensPro AI digital signal processor (DSP) with Mobilint’s proprietary AI processing architecture. The multi-engine design is intended to distribute…
Mobilint announced that its SoC REGULUS integrates the SensPro DSP and the NeuPro-Nano NPU of Ceva. The company highlights up to 10 TOPS of performance, a 3W TDP and a design aimed at AI applications that process data directly on the device. Ceva presents integration as the first deployment in production of its NeuPro family.
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