The Commerce Department is hurrying to finalize federal subsidies to semiconductor manufacturers to ensure domestic sources of the vital computer processors.

Inc.

Former Startup Rocket Lab Wins Chip Making Grant, Along with BAE Systems

The Biden administration announced on Monday it has finalized the grants from the CHIPs Act for Rocket Labs (RKLB) and BAE Systems (BAESF). Read for more.

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Seeking Alpha

United States

Biden administration finalizes CHIPs Act awards for Rocket Labs, BAE Systems

WASHINGTON - The U.S. Commerce Department said on Monday it is finalizing nearly $60 million in government subsidies for BAE Systems to build chips used in jets and satellites, and for Rocket Lab to build compound semiconductors used in satellites…

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New Hampshire Union Leader

New Hampshire

$35.5M for BAE Systems to quadruple chip production in NH finalized

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Rocket Lab Signs $23.9M CHIPS Incentives Award to Boost Semiconductor Manufacturing

Joe Mansueto

By David Shepardson WASHINGTON (Reuters) –     The U.S. Commerce Department said on Monday it is finalizing nearly $60 million in government subsidies for BAE Systems to build chips used in jets and satellites, and for Rocket Lab to build compound semiconductors used in satellites and spacecraft.  The department is finalizing $35.5 million to BAE  to quadruple production in New Hampshire for key semiconductor chips used in F-35 fighter jets and …

regionalmedianews.com

US finalizes awards to BAE Systems, Rocket Lab for semiconductor chips - Regional Media News

By David Shepardson WASHINGTON (Reuters) - The US Commerce Department said on Monday it is finalizing nearly $60 million in government subsidies for BAE Systems (BAESF) to build chips used in jets and satellites, and for Rocket Lab (RKLB) to build compound semiconductors used in satellites and spacecraft. The

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US finalizes awards to BAE Systems, Rocket Lab for semiconductor chips

The Department of Commerce is investing up to $300 million to accelerate the development of technologies to boost the semiconductor industry. The department said Thursday the three entities receiving up to $100 million in federal funding each will conduct advanced packaging research projects meant to boost innovation in semiconductor research, development and manufacturing. The total funding

GovCon Wire

DOC Awards $300M for Semiconductor Packaging - GovCon Wire

The Senate Homeland Security and Governmental Affairs Permanent Subcommittee on Investigations, which has been looking into how U.S. computing chips have ended up in Russian weapons, hopes to issue a new report on its work before year's end, the panel's...

Former Startup Rocket Lab Wins Chip Making Grant, Along with BAE Systems

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