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Taiyo Holdings Launches Next-generation Semiconductor-packaging Material "FPIM (TM) Series," Its First Successful Formation of 3-layer RDL with CD 1.6 Micrometers on 12-inch Wafer
Taiyo Holdings and imec achieved a three-layer redistribution layer with 1.6 micrometer lines on a 12-inch wafer, advancing semiconductor packaging materials.
- Taiyo Holdings Co., Ltd. and imec presented a paper at the 14th IEEE CPMT Symposium Japan on Nov. 13, 2025, introducing the FPIM™ Series for fine-pitch damascene RDLs.
- The collaboration began in October 2022 with imec, and Taiyo Holdings dispatched resident researchers to deepen joint research on RDL materials, mainly produced by the semi-additive process.
- Achieved wiring pitches included CD 1.6 micrometers for RDL layers using a Veeco Low NA i-line exposure system AP300, near its resolution limit.
- Electrical evaluations showed favorable leakage current and resistance for the RDL1 layer at CD 1.6 micrometers, confirming CMP process suitability while small-quantity sample shipments began in 2025.
- Taiyo Holdings will continue developing materials to advance packaging and AI semiconductors, using the damascene process with seed layer formation and electroplating, supported by open innovation by imec.
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Leaning Left6Leaning Right4Center8Last UpdatedBias Distribution45% Center
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45% Center
L 33%
C 45%
R 22%
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