Intel targets 2026 for Diamond Rapids Xeon, delivering up to 768 cores in a single rack
5 Articles
5 Articles
Intel Reportedly Making Progress With 18A Yields, Surpassing Samsung’s 2nm But Still Trailing TSMC’s N2 Process
There's finally some great news from Intel's camp, as it is now reported that the 18A process has reached yield rates that are higher than what competitors are currently at. Intel's 18A Yield Rates Are Sufficient Enough For HVM By Q4 2025; First Integration With Panther Lake SoCs Before we get into the rumors, it is important to take them with a grain of salt since many specifics surrounding the yield rate figures have yet to be disclosed. Now, …
SCIENCE & TECH: Intel’s new Xeon chip will deliver dense compute with 500W TDP and next-gen socket for large-scale enterprise use – U-S-NEWS.COM
Intel plans to launch its next-generation Xeon platform, codenamed Oak Stream, in 2026, which will include Diamond Rapids, a CPU built for servers and high-performance workloads. Diamond Rapids will use Intel’s 18A process and Panther Cove cores, the same architecture coming to future consumer chips. The top model includes four compute tiles, each with 48 performance cores, adding up to a total of 192 cores per socket. You may like New socket ty…
Want a quad-socket server with 768 cores? Sure, Intel's 192-core Diamond Rapids Xeon CPU will deliver that in 2026 — but I wonder whether it will be too little, too late - WorldNL Magazine
Intel plans to launch its next-generation Xeon platform, codenamed Oak Stream, in 2026, which will include Diamond Rapids, a CPU built for servers and high-performance workloads.Diamond Rapids will use Intel’s 18A process and Panther Cove cores, the same architecture coming to future consumer chips.The top model includes four compute tiles, each with 48 performance cores, adding up to a total of 192 cores per socket.New socket typeWith support f…
Intel Nova Lake-S Allegedly Taped Out on TSMC 2nm; Arrow Lake Refresh on the Horizon
Intel’s next-gen Nova Lake-S CPU die has allegedly taped out. In other words, the first fabricated dies have arrived from the fab for testing and quality control. The interesting part is that the tape-out comes from TSMC’s 2nm-class manufacturing, making Nova Lake-S the second “Core Ultra” desktop lineup using third-party capacity. Increased Reliance on TSMC; IDM for Halo Mobility Tiles? Previously, Lunar Lake and Arrow Lake-S also used compute …
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