Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures using a system-technology co-optimization approach

Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures using a system-technology co-optimization approach

Holistic system-technology co-optimization (STCO) approach key in reducing peak GPU and HBM temperatures under AI workloads while enhancing performance density of future GPU-based architectures

Imec 3D HBM-on-GPU STCO Study Shows Major Thermal Improvements

This week, at the 2025 IEEE International Electron Devices Meeting (IEDM), imec, world-leading research center in advanced semiconductor technologies, presents the first thermal system-technology co-optimization (STCO) study of 3D HBM-on-GPU (high-bandwidth memory on graphical processing unit), a promising compute architecture for next-gen AI applications. By combining technology and system-level mitigation strategies, peak GPU temperatures coul…