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Published 2 years ago

How TSMC killed 450mm wafers for fear of Intel

Summary by Ground News
A former TSMC executive has described how a collaborative effort towards 450mm (18-inch) wafers for manufacturing chips was halted when the company realized it would put them in direct competition with Intel and Samsung. Currently, the largest wafer used to produce chips at any scale in the semiconductor industry are 300mm (12 inches) in diameter.

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How TSMC killed 450mm wafers for fear of Intel

You can be a big fish in a big ocean or a small fish in a tiny pond with two leviathans.. how times changed

2 years ago
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