US EditionAdvanced packaging emerges as AI's next performance frontier, insights from DIGITIMES analyst Tony Huang
Taiwan holds about 77% of the global AI data-center packaging market, growing at a 45.5% CAGR through 2030 as 3D and hybrid packaging replace 2.5D solutions.
- Yesterday, DIGITIMES published a preview and Tony Huang will expand the analysis at a December 5, 2025 webinar, forecasting advanced packaging for AI chips to grow at a 45.5% CAGR from 2024 to 2030.
- Facing multiple technical 'walls', Huang says advanced packaging is driven by the memory, I/O, power, and yield bottlenecks, promoting heterogeneous integration.
- Using techniques like 3D SoIC stacking, hybrid bonding, and co‑packaged optics enable performance gains as industry shifts from 2.5D to 3.5D approaches, with Huang estimating compute density rises from 80 to 320 times.
- Taiwan's market share reached about 90% in 2024, Huang said, with projections near 70% by 2030 amid competition from Intel, Samsung, and Chinese ecosystems.
- Across AI server CPUs, accelerators and networking chips, Huang projects their market share will decline from 69% to 58% as 3D and hybrid approaches mature, and DIGITIMES projects Chinese shipments could surpass 15% by 2030.
54 Articles
54 Articles
Advanced packaging emerges as AI's next performance frontier, insights from DIGITIMES analyst Tony Huang
TAIPEI, Nov. 27, 2025 /PRNewswire/ -- As Moore's Law slows, advanced packaging has become the critical lever driving breakthroughs in AI chip performance, according to DIGITIMES chief semiconductor analyst Tony Huang. Speaking with DIGITIMES Asia, Huang emphasized that heterogeneous integration…
Advanced packaging emerges as AI's next performance frontier, insights from DIGITIMES analyst Tony Huang
TAIPEI, Nov. 27, 2025 /PRNewswire/ -- As Moore's Law slows, advanced packaging has become the critical lever driving breakthroughs in AI chip performance, according to DIGITIMES chief semiconductor analyst Tony Huang. Speaking with DIGITIMES Asia, Huang emphasized that heterogeneous integration…
Advanced packaging emerges as AI's next performance frontier, insights from DIGITIMES analyst Tony Huang
TAIPEI, Nov. 27, 2025 /PRNewswire/ -- As Moore's Law slows, advanced packaging has become the critical lever driving breakthroughs in AI chip performance, according to DIGITIMES chief semiconductor analyst Tony Huang. Speaking with DIGITIMES Asia, Huang emphasized that heterogeneous integration…
Advanced packaging emerges as AI's next performance frontier, insights from DIGITIMES analyst Tony Huang
TAIPEI, Nov. 27, 2025 /PRNewswire/ -- As Moore's Law slows, advanced packaging has become the critical lever driving breakthroughs in AI chip performance, according to DIGITIMES chief semiconductor analyst Tony Huang. Speaking with DIGITIMES Asia, Huang emphasized that heterogeneous integration…
Advanced packaging emerges as AI's next performance frontier, insights from DIGITIMES analyst Tony Huang
TAIPEI, Nov. 27, 2025 /PRNewswire/ -- As Moore's Law slows, advanced packaging has become the critical lever driving breakthroughs in AI chip performance, according to DIGITIMES chief semiconductor analyst Tony Huang. Speaking with DIGITIMES Asia, Huang emphasized that heterogeneous integration…
Advanced packaging emerges as AI's next performance frontier, insights from DIGITIMES analyst Tony Huang
TAIPEI, Nov. 27, 2025 /PRNewswire/ -- As Moore's Law slows, advanced packaging has become the critical lever driving breakthroughs in AI chip performance, according to DIGITIMES chief semiconductor analyst Tony Huang. Speaking with DIGITIMES Asia, Huang emphasized that heterogeneous integration…
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